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Mobile World Congress 2009: BSQUARE and TI work together on hardware designs for Windows Mobile 6.5 February 14, 2009 [Pocket PC phone] | By Edward J. R. The big wave of Windows Mobile 6.5 news is starting and next week, when Mobile World Congress 2009 will be officially open, we can expect even more... BSP denotes "board support package" and practically it means a hardware design that can be used by mobile phone manufacturers to design phones. It's nice to seek that apart from NVidia, also Texas Instruments (TI) will be offering hardware platform for Windows Mobile (and Windows Mobile 6.5 is explicitly mentioned!) that will enable high performance for graphics operations and HD video playback... More information from BSQUARE follows. * * * * * BSQUARE and Texas Instruments collaborate on first Windows Mobile 6.5 Board Support Package for the Texas Instruments OMAP 3 platform Optimized Windows Mobile BSP enables mobile device OEMs to quickly implement advanced multimedia and power management features to accelerate time-to-market BSQUARE Corporation announced the availability of its jointly developed, optimized Windows Mobile 6.5 board support package (BSP) for the Texas Instruments Incorporated (TI) OMAP 3 platform. The production-quality software foundation (including BSP, multimedia, imaging graphics, power management and security) accelerates time-to-market, supports higher quality products and reduces costs for Windows Mobile 6.5-based phones, gaming devices and data collection terminals. Now, OEMs creating Windows Mobile designs with OMAP 3 processors can quickly implement consumer-demanded functionality including full, high-definition (HD) camcorder record and playback on 720p displays; advanced user interface (UI) using 3D hardware accelerated graphics using OpenGL ES 2.0 technology; camera support for up to 12MP imaging using OMAP 3 platform’s on-chip ISP; and sophisticated power management functionality. “BSQUARE and TI have worked together to quickly and confidently leverage the full functionality of TI’s powerful OMAP 3 platform while taking advantage of the newest release of Windows Mobile operating system though an optimized Windows Mobile 6.5 BSP for Windows Mobile OEMs,” said Akshay Agarwal, TI’s Worldwide Ecosystem Partner Manager. “The jointly developed BSQUARE BSP leverages TI’s OMAP processor to provide a solid foundation for OEMs innovating Windows Mobile designs to add camcorder functionality, high-resolution camera features, full-page Web browsing and extended battery life to new products.” The Windows Mobile 6.5 software foundation for TI’s OMAP 3 platform also features TI’s WiLink 6.0 solution with support for WLAN, GPS, Bluetooth and FM transmit and receive capabilities through the WL1271 chip. Demonstration at Mobile World Congress The new Windows Mobile 6.5 software foundation will be demonstrated in TI’s Stand #8A84, Hall 8, at Mobile World Congress, Barcelona, Feb. 16 – 19, 2009. Availability and Support The Windows Mobile 6.5 software foundation is available from BSQUARE. Email sales@bsquare.com or call 425-820-4500 for more information. Credit: Emilie Salvagio (over email).  Post your comment (free registration is required to post, but if you register you can edit your posts later) [ 1 Comment ]
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